Discovery HR30 resin rheology and cure characterization
Obtain resin flow and cure data for material comparisons and mold-flow inputs during short-shot evaluation.
TA Instruments
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- Incomplete molding fill requires batch-specific flow and cure data under relevant temperature, shear and time histories.
Other names: TA Instruments | Waters Corporation
Applications: Packaging resins / EMC · Cured packaging polymers · Packaging polymers and substrate materials · Paired lid-adhesive samples · Solid TIM/heat-spreader specimens
Catalog solutions · 5
Discovery DMA 850 solid-package-material viscoelastic characterization
Characterize cured packaging polymers across temperature and time scales for warpage-model inputs.
Discovery TMA 450 thermal expansion and shrinkage measurement
Obtain thermal expansion and shrinkage histories as material inputs for package-warpage comparisons.
Discovery DSC 2500 adhesive residual-reaction comparison
Lid-adhesive cure comparisons need a formulation-specific reaction reference and processed samples.
DLF 1200 solid-material thermal diffusivity
Separate TIM material transport from assembled contact resistance.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Discovery DMA 850 solid-package-material viscoelastic characterization · Warpage reversal during cooling in large 2.5D FCBGA packages →
- Discovery TMA 450 thermal expansion and shrinkage measurement · Warpage reversal during cooling in large 2.5D FCBGA packages →
- DLF 1200 solid-material thermal diffusivity · Uneven heat-spreader contact and local hot spots in multi-die packages →
- Discovery DSC 2500 adhesive residual-reaction comparison · Heat-spreader seal adhesion and cure →
- Discovery HR30 resin rheology and cure characterization · Incomplete mold filling and short shots →
Public sources
- Product information: Discovery HR30 resin rheology and cure characterization
- Product information: Discovery DMA 850 solid-package-material viscoelastic characterization
- Product information: Discovery TMA 450 thermal expansion and shrinkage measurement
- Product information: Discovery DSC 2500 adhesive residual-reaction comparison
- Product information: DLF 1200 solid-material thermal diffusivity
Contact information
Contact the supplier directly through its official channels.
These contacts cover TA Instruments materials thermal analysis, rheology, heat transfer and mechanical testing instruments. The quote form provides matching product families and an Electronics industry option. Service and applications support have separate routes. The Waters-domain mailboxes are listed in the official TA directory. Official source ↗
United States · Headquarters
TA Instruments — Corporate Headquarters
- Phone
- +1 302 4274000
Official source ↗Source checked
Taiwan · Supplier office
TA Instruments — Waters Asia Limited, Taiwan Branch
- TA_Taiwan@waters.com
- Phone
- +886 2 25638880
Official source ↗Source checked
Mainland China · Supplier office
TA Instruments — Waters Technology (Shanghai) Ltd.
- TA_China@waters.com
Official source ↗Source checked
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