MCL-E-770G Type R/RLH low-warpage package substrate material
Resonac · Material properties and interface engineering
- Purpose
- Targets package warpage in FC-CSP, PoP and SiP substrates driven by CTE mismatch and insufficient stiffness.
- Technical approach
- Uses a halogen-free laminate with high Tg, high modulus and low in-plane CTE to restrain substrate deformation through assembly and reflow temperatures.
- Scope of use
- Intended for thin, high-density FC-CSP, PoP and SiP substrates where coplanarity matters. Adoption should include drilling, plating, lamination and assembly-process evaluation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsLow CTE alone does not ensure low package warpage; copper distribution, stackup and processing still matter. The published RLH CTE applies to its stated test range, not other grades or reflow temperatures.
What to prepareBring substrate stackup, copper distribution, dimensions, process profiles and measured warpage, plus electrical and reliability targets, to assess the effects of a material change.
Confirm with the supplierConfirm grade, available thicknesses, temperature-dependent properties and compatibility with lamination, drilling and plating. Discuss warpage and reliability validation using representative substrates rather than CTE alone.
- Public evidence
- The official page lists FC-CSP, PoP and SiP applications, high Tg and low CTE. Type RLH has an X/Y CTE of 1.5–2.0 ppm/°C at 30–100°C; the table labels these experimental results, not guarantees.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.