MCL-E-770G Type R/RLH low-warpage package substrate material
Targets package warpage in FC-CSP, PoP and SiP substrates driven by CTE mismatch and insufficient stiffness.
Resonac
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View contact information ↓Public capability summary
- Low-CTE laminates · packaging materials · warpage control
Applications: FC-CSP, PoP and SiP substrates · Flip-chip and high-density package substrates · Thin-wafer dicing and die attachment · FCBGA dispense/fillet evaluation · Organic-substrate encapsulant/interface evaluation
Catalog solutions · 5
SR7300 / SR-F low-CTE, low-shrinkage solder resist for package substrates
Package-substrate solder resist can contribute to cure shrinkage, thermal expansion and warpage alongside stack-up and copper distribution.
Resonac FH dicing/die bonding film
Thin-wafer dicing and pickup need stable handling and assessment of die-attach film contact.
Resonac CEL-C liquid underfill for FCBGA
FCBGA fillet assessment needs material/dispensing comparisons that consider gap filling and keep-out areas.
Resonac CEL/GE EMC for organic-substrate packages
Moisture/reflow delamination comparisons need both encapsulant and actual-interface evidence.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- MCL-E-770G series low-CTE substrate materials · Warpage reversal during cooling in large 2.5D FCBGA packages →
- SR series solder-mask materials for package substrates · Warpage reversal during cooling in large 2.5D FCBGA packages →
- Resonac CEL/GE EMC for organic-substrate packages · New delamination after reflow in moisture-exposed packages →
- Resonac CEL-C liquid underfill for FCBGA · Underfill fillet interference with keep-out areas →
- Resonac FH dicing/die bonding film · Initial die-attach voids and incomplete coverage →
Public sources
- Product information: MCL-E-770G Type R/RLH low-warpage package substrate material
- Technical reference: Copper-clad laminates for semiconductor packages (PDF)
- Product information: SR7300 / SR-F low-CTE, low-shrinkage solder resist for package substrates
- Public reference: sites/default/files/2022-12/en-pdf-rd-report-054-54_r7.pdf
- Product information: Resonac FH dicing/die bonding film
- Product information: Resonac CEL-C liquid underfill for FCBGA
- Product information: Resonac CEL/GE EMC for organic-substrate packages
Contact information
Contact the supplier directly through its official channels.
The Taiwan company lists semiconductor CMP polishing materials and photosensitive dry film for printed wiring boards. For other packaging materials, use the Asia Pacific general inquiry form and specify the product to confirm the responsible contact. Official source ↗
Taiwan · Supplier office
Resonac Semiconductor Materials (Taiwan) Co., Ltd.
- Phone
- +886 6 5053111
Official source ↗Source checked
Singapore · Supplier office
Resonac Asia Pacific Pte. Ltd. — General Inquiry
- Phone
- +65 6836 6988
Official source ↗Source checked
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