Resonac FH dicing/die bonding film
Resonac · Material properties and interface engineering
- Purpose
- Thin-wafer dicing and pickup need stable handling and assessment of die-attach film contact.
- Technical approach
- FH combines dicing tape and die-bonding film for simultaneous wafer lamination and subsequent dicing, pickup and attachment.
- Scope of use
- Thin-wafer film-attach workflows need matched grades, wafer thickness and equipment conditions.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsTypical grade data do not qualify bond coverage, voids or reflow reliability. Wire bondability before film curing does not mean a universally cure-free process.
What to prepareBLNKK suggests preparing wafer/die dimensions, lamination/UV settings, pickup method, attach temperature/pressure, cure history and void observations.
Confirm with the supplierConfirm grade-specific process windows, storage/handling, pickup/cure sequence and bond-coverage/reflow validation.
- Public evidence
- Resonac describes the Furukawa co-developed film and FH-9011 typical process/material properties.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.