Resonac CEL/GE EMC for organic-substrate packages

Resonac · Material properties and interface engineering

Purpose: Moisture/reflow delamination comparisons need both encapsulant and actual-interface evidence.
Technical approach: CEL/GE epoxy molding compounds encapsulate organic-substrate packages; grade-specific thermal properties and molding shrinkage inform selection.
Scope of use: Candidates for BGA, CSP and stacked MCP, subject to grade, surface and molding-process compatibility.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Published characteristics do not establish an MSL rating or delamination-free target package. Typical values are not universal guarantees; changing material does not repair existing delamination.
What to prepare
BLNKK suggests recording grade, surfaces/pretreatment, molding/cure and moisture/drying/reflow history, with pre/post-reflow C-SAM comparisons.
Confirm with the supplier
Confirm grade availability, molding window, moisture-absorption and adhesion data, and validation criteria for the actual stack.
Public evidence: The page describes reflow-crack resistance and low molding warpage, with separate typical-property tables.

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