SR7300 / SR-F low-CTE, low-shrinkage solder resist for package substrates

Resonac · Material properties and interface engineering

Purpose: Package-substrate solder resist can contribute to cure shrinkage, thermal expansion and warpage alongside stack-up and copper distribution.
Technical approach: SR7300 is liquid and SR-F is film photosensitive solder resist. Resonac positions their low-CTE, low-shrinkage formulations for package substrates.
Scope of use: Relevant to package substrates requiring solder-mask openings and reflow or thermal-cycle reliability. Confirm the grade, thickness and process for the actual stack.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Series data and comparisons do not guarantee every grade/customer substrate achieves the same warpage or durability.
What to prepare
BLNKK suggests preparing stack-up, copper distribution, mask thickness and openings, exposure, development and cure conditions, plus warpage and reliability targets.
Confirm with the supplier
Confirm grades/thicknesses, property methods, processing windows and the specimens, thermal profiles and criteria behind published tests.
Public evidence: The supplier’s series table lists Tg of 130–140°C, α1 CTE of 38 ppm/°C and modulus of 5,000 MPa at 23°C, with continuity and acoustic comparisons through 3,000 thermal cycles. Complete specimen and cycling conditions are undisclosed; these are not customer-substrate guarantees.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.