Resonac CEL-C liquid underfill for FCBGA

Resonac · Material properties and interface engineering

Purpose: FCBGA fillet assessment needs material/dispensing comparisons that consider gap filling and keep-out areas.
Technical approach: CEL-C liquid underfill fills flip-chip gaps and cures around the interconnects.
Scope of use: CEL-C3730 is a candidate for FCBGA underfill; validate actual gaps, surfaces, dispensing and curing.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Public information does not establish a specific fillet-control window or guarantee no overflow/voids. Do not transfer conditions between CEL-C variants.
What to prepare
BLNKK suggests preparing bump pitch/gap, keep-outs, material/surface condition, dispense volume/location, preheat/cure and fillet/void observations.
Confirm with the supplier
Confirm grade-specific flow/cure data, surface compatibility, storage/handling and assembly-specific filling, fillet and reliability validation.
Public evidence: Resonac identifies this series for FCBGA, describing CTE matching and humidity/reflow resistance with typical cure conditions.

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