Indium Durafuse LT mixed-alloy solder system

Indium Corporation · Material properties and interface engineering

Purpose: BGA fatigue comparisons must control solder, joint geometry and reflow history.
Technical approach: Durafuse LT combines low-melting indium-containing alloy with higher-melting SAC alloy; reflow promotes joint fusion.
Scope of use: For assemblies considering reduced reflow temperature; select paste version, ball alloy and profile for the application.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Published cycling examples do not guarantee BGA life; WLCSP results do not transfer automatically. Different applications and flux versions require different profiles.
What to prepare
BLNKK suggests recording ball/paste, pad/joint geometry, measured profiles and failure criteria, using consistent cycling comparisons.
Confirm with the supplier
Confirm paste version, fusion conditions, profile and compatibility, and agree sectioning, electrical and reliability checks on actual joints.
Public evidence: The product page and the 100184 R1 note describe mixed-alloy fusion, application-specific profiles and thermal-cycle comparisons.

Supporting references

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