Heat-Spring HSx compressible metal thermal interface
Uneven gaps between curved or warped dies and heat sinks can impair contact and raise local thermal resistance, requiring a TIM that conforms to non-planarity.
Indium Corporation
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View contact information ↓Public capability summary
- Thermal interface · die attach · semiconductor assembly materials
Applications: Warped and non-planar thermal interfaces · IGBT and SiC modules, DBC/AMB and baseplates · BGA reflow wetting · BGA solder/thermal-fatigue evaluation
Catalog solutions · 4
InFORMS reinforced solder preforms for controlled bondlines
Assembly tilt can create uneven solder bondlines and concentrated thermomechanical stress in power modules. Reinforced preforms provide internal standoffs for bondline and reliability evaluation.
Indium8.9HF solder-paste wetting and oxidation control
Evaluate reflow wetting and oxidation control as material options for head-in-pillow and graping defects.
Indium Durafuse LT mixed-alloy solder system
BGA fatigue comparisons must control solder, joint geometry and reflow history.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Heat-Spring HSx compressible metal thermal interface · Uneven heat-spreader contact and local hot spots in multi-die packages →
- Solder-paste wetting and oxidation-control comparisons · BGA head-in-pillow open joints →
- Indium8.9HF solder-paste wetting and oxidation control · BGA head-in-pillow open joints →
- Indium Durafuse LT mixed-alloy solder system · Board-level BGA solder-joint fatigue under thermal cycling →
- Solder delivery and reflow-outgassing comparison · Initial die-attach voids and incomplete coverage →
- InFORMS reinforced solder preforms for controlled bondlines · Copper-clip attachment integrity in power devices →
Public sources
- Product information: Heat-Spring HSx compressible metal thermal interface
- Technical reference: Heat-Spring no-reflow metal TIM: selection and use conditions (PDF)
- Product information: InFORMS reinforced solder preforms for controlled bondlines
- Public reference: wp-content/uploads/2025/03/InFORMS®-PDS-97548-A4-R14.pdf
- Product information: Indium8.9HF solder-paste wetting and oxidation control
- Product information: Indium Durafuse LT mixed-alloy solder system
Contact information
Contact the supplier directly through its official channels.
The Taiwan channel contact is Chipsource Technology Inc., listed by Indium Corporation; use the manufacturer's partner inquiry form. The quote form includes country/region and material-category fields. Official source ↗
United States · Headquarters
Indium Corporation — Global Headquarters
- askus@indium.com
- Phone
- +1 315 853 4900
Official source ↗Source checked
Taiwan · Supplier-listed distributor · Sales inquiries
Chipsource Technology Inc. — Indium Corporation Taiwan Sales Channel Partner
Contact websiteOfficial source ↗Source checked
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