Samsung Foundry 2.5D Cube-S silicon interposer platform

Samsung Foundry · Package architecture and warpage compensation

Purpose: HBM thermal-coupling assessment needs logic/memory placement and the actual package stack.
Technical approach: 2.5D Cube-S integrates logic and HBM horizontally on a silicon interposer with dense chip-to-chip connections.
Scope of use: Logic/HBM architecture and thermal-model preparation need actual configurations, materials and cooling conditions.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Platform descriptions do not validate customer layer temperatures or thermal coupling. Quantitative predictions need actual materials, interfaces, power and cooling data.
What to prepare
BLNKK suggests preparing die/HBM layout/dimensions, layer thicknesses/thermal properties, power maps, attachment interfaces, cooling boundaries and temperature references.
Confirm with the supplier
Confirm available interposer/HBM configurations, stack-model data, analysis/measurement support and applicable validation conditions.
Public evidence: Samsung describes Cube-S silicon-interposer/CoW integration separately from other interposer and vertical-stack schemes.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.