3D X-Cube / 3D Cube vertical die-stacking platform
AI/HPC systems use vertical stacking to shorten die-to-die connections and increase integration density, while managing cooling, interface integrity and thermomechanical reliability.
Samsung Foundry
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- 3D X-Cube / 3D Cube vertical die-stacking platform · Package architecture and warpage compensation
- Samsung Foundry 2.5D Cube-S silicon interposer platform · Package architecture and warpage compensation
Applications: AI/HPC, logic-memory and 3D systems · HBM package-layer/thermal-model preparation
Catalog solutions · 2
Samsung Foundry 2.5D Cube-S silicon interposer platform
HBM thermal-coupling assessment needs logic/memory placement and the actual package stack.
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CONNECT is the Samsung Foundry customer portal and requires sign-in. Consumer product support does not handle foundry or advanced packaging inquiries. Official source ↗
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Samsung Foundry — Public Contact
- foundry@samsung.com
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