MWAT warpage-adjustment tool for reconstituted wafers

ERS electronic · Process equipment and thermal control

Purpose: Warpage in molded FOWLP wafers can hinder handling and downstream processing. MWAT offers a post-molding adjustment step for R&D and pilot-line evaluation.
Technical approach: ERS TriTemp Slide applies controlled thermal conditioning with stored process recipes. An oxygen-free option is available for oxidation-sensitive wafers.
Scope of use: The tool supports 200 or 300 mm molded, reconstituted wafers, particularly FOWLP. ERS positions it for R&D laboratories and technology-ramp pilot lines.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Typical output and maximum throughput are not guarantees for every wafer. Adjustment does not establish that material or structural causes are resolved.
What to prepare
BLNKK suggests preparing wafer dimensions, stack details, warpage measurements and downstream thermal budgets, then evaluating representative samples.
Confirm with the supplier
Confirm model, stations, recipes, acceptance criteria and oxygen-free options. Discuss material compatibility and subsequent reliability checks.
Public evidence: Published limits are ±5 mm input and typically <500 µm output. Up to 25 UPH is product-dependent; −10°C to +260°C is station-dependent.

Supporting references

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