MWAT warpage-adjustment tool for reconstituted wafers
Warpage in molded FOWLP wafers can hinder handling and downstream processing. MWAT offers a post-molding adjustment step for R&D and pilot-line evaluation.
ERS electronic
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- Wafer and panel warpage measurement · thermal debond process
Applications: FOWLP reconstituted wafers in R&D and pilot lines · Reconstituted, thin and molded wafers
Catalog solutions · 2
Wave3000 contactless wafer warp, bow and thickness metrology
Reconstituted and thin wafers can change shape with processing, support and temperature. Whole-wafer bow, warp and thickness measurements support handling and process decisions.
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Contact information
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United States · Supplier office
ERS electronic — Americas / Dallas
- Phone
- +1 214 686 0053
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Taiwan · Supplier office
ERS electronic — Taiwan / Zhubei
- perino@ers-gmbh.de
- Phone
- +886 972 077 305
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Mainland China · Supplier office
ERS electronic — China / Shanghai
- zhang@ers-gmbh.de
- Phone
- +86 21 5999 1200
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More regional contacts (2)
Germany · Headquarters
ERS electronic GmbH — Germering / Munich Headquarters
- info@ers-gmbh.de
- Phone
- +49 89 894132 0
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Taiwan · Supplier-listed distributor · Sales inquiries
Chain Logic International Corp. — ERS Taiwan Sales Representative
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