TohoSpec 3100 film-thickness inputs for RDL models

Toho Technology · Engineering measurement and characterization

Purpose: RDL thermomechanical models need actual film thicknesses rather than nominal stacks alone.
Technical approach: TohoSpec3100 uses spectral reflectance and configurable optical-film models to analyze thickness and optical parameters.
Scope of use: Films need identifiable reflected signals; validate materials, layer count and configuration for oxide, nitride and resist stacks.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Standard, thick-film and optional-objective specifications differ; oxide-on-silicon ranges do not apply to all materials. Thickness analysis does not directly measure stress or electrical opens.
What to prepare
BLNKK suggests preparing layer order, materials, nominal thicknesses, optical constants, accessible sites and reference thickness/section data.
Confirm with the supplier
Confirm current configuration/availability, objective/spot, identifiable layer count and fitting model; discuss repeatability and uncertainty for actual stacks.
Public evidence: The actual two-page specification describes models, objectives and configurations; the current directory still lists TohoSpec3100.

Supporting references

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