FLX-2320-S / FLX-3300-T thermal thin-film stress metrology
Thermal-expansion mismatch and changing film stress can cause wafer bending, cracks or voids. Before/after measurements can miss behavior during heating and cooling.
Toho Technology
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- FLX-2320-S / FLX-3300-T thermal thin-film stress metrology · Warpage, topography and stress metrology
- TohoSpec 3100 film-thickness inputs for RDL models · Engineering measurement and characterization
Applications: Wafers and thin-film stacks · As-built RDL film stacks
Catalog solutions · 2
TohoSpec 3100 film-thickness inputs for RDL models
RDL thermomechanical models need actual film thicknesses rather than nominal stacks alone.
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The product inquiry form covers FLX stress measurement, TohoSpec film thickness and profiling. Supplier-listed Quatek / Caltron is based in Hong Kong and serves Taiwan and other territories for FLX and TohoSpec. Confirm product and territory coverage when contacting them. Official source ↗
United States · Supplier office
Toho Technology Inc. — Chicago
- Phone
- +1 773 5837183
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Hong Kong · Supplier-listed distributor
Quatek / Caltron
- Phone
- +852 23601812
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