FLX-2320-S / FLX-3300-T thermal thin-film stress metrology
Toho Technology · Warpage, topography and stress metrology
- Purpose
- Thermal-expansion mismatch and changing film stress can cause wafer bending, cracks or voids. Before/after measurements can miss behavior during heating and cooling.
- Technical approach
- FLX scans wafer curvature using selectable laser wavelengths and converts curvature changes into film stress using substrate biaxial modulus, substrate/film thickness and the Stoney relation.
- Scope of use
- The thermal models support film-process development: FLX-2320-S scans up to 200 mm and FLX-3300-T up to 300 mm. Heating reaches 500°C; subambient measurement requires an option.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsStress is inferred from curvature and material inputs, not measured locally inside a package. Confirm model assumptions, reflected signals and sampling for multilayer or nonuniform specimens.
What to prepareBring pre/post-deposition samples, film/substrate thicknesses, modulus data, surface condition, thermal profiles and regions of interest to plan measurement and interpretation.
Confirm with the supplierConfirm S/T model suitability, holders, subambient/3D-analysis options, and calibration/repeatability acceptance. Ask about multilayer stress separation and data export.
- Public evidence
- Official model specifications describe thermal cycling and curvature/stress analysis, with -65°C cooling optional. The theory page distinguishes measured curvature from calculated stress.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
These links use established solution relationships. Continue to engineering conditions and evaluation preparation.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.