VibroFlex wirebond-process vibration comparison

Polytec · Engineering measurement and characterization

Purpose: Wire-bond pad motion needs separate evaluation from bond quality.
Technical approach: VibroFlex uses non-contact laser Doppler sensing with task-specific heads and reference acquisition.
Scope of use: Evaluate optically accessible pads/structures; the official wire-bond application concerns thick aluminum wires.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Motion does not establish adhesion or fatigue life. Thick-wire and older OFV research does not qualify fine wires or current VibroFlex configurations.
What to prepare
BLNKK suggests documenting wires, pads, process frequencies and optical access, synchronizing excitation/bonding records and adding pull/shear comparisons.
Confirm with the supplier
Confirm head, bandwidth, spot/access, reference synchronization and sample feasibility, together with the separate bond-quality acceptance method.
Public evidence: Current pages describe modular sensing and wire-bond applications; the 2010 paper uses older OFV systems.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.