TopMap Micro.View CSI 3D metrology for microstructures and BGA
Measures ball and bump heights, coplanarity and visible topography to distinguish local height differences from package bow.
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View contact information ↓Applications: Wafers, BGA, MEMS and die-bonding surfaces · Visible wirebond pads and structures · Visible fixation microstructures
Measures ball and bump heights, coplanarity and visible topography to distinguish local height differences from package bow.
Wire-bond pad motion needs separate evaluation from bond quality.
Compare visible microstructure motion in a fiber-fixation investigation, separately from actual optical coupling loss.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
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Taiwan entries are representatives listed by Polytec for vibrometry and surface metrology. China, US and Germany entries are direct Polytec offices. Official source ↗
United States · Supplier office
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Taiwan · Supplier-listed distributor
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Mainland China · Supplier office
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Germany · Headquarters
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Taiwan · Supplier-listed distributor
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