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Polytec

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Public capability summary

  • TopMap Micro.View CSI 3D metrology for microstructures and BGA · Warpage, topography and stress metrology
  • VibroFlex wirebond-process vibration comparison · Engineering measurement and characterization
Measurement, inspection and failure localizationMaterial properties and interface designProcess equipment and window control

Applications: Wafers, BGA, MEMS and die-bonding surfaces · Visible wirebond pads and structures · Visible fixation microstructures

Catalog solutions · 3

Candidates in engineering problem guides

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Contact information

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Taiwan entries are representatives listed by Polytec for vibrometry and surface metrology. China, US and Germany entries are direct Polytec offices. Official source ↗

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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.