TopMap Micro.View CSI 3D metrology for microstructures and BGA
Polytec · Warpage, topography and stress metrology
- Purpose
- Measures ball and bump heights, coplanarity and visible topography to distinguish local height differences from package bow.
- Technical approach
- Coherence scanning interferometry scans broadband light vertically and evaluates interference signals to reconstruct surfaces. Stitching extends coverage; stages, cameras and automation options differ between Micro.View and Micro.View+.
- Scope of use
- Potential evaluations include BGA balls, bumps and microstructured surfaces for height, coplanarity and topography. Optics, sample stages and stitching coverage require sample-specific selection; surface profiling does not establish in-reflow dynamic warpage measurement.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsVisible surface metrology does not establish buried-defect detection. Digital resolution is not measurement accuracy.
What to prepareBLNKK suggests ball dimensions/layout, the coplanarity reference, package dimensions and representative samples, separating package bow from ball-height variation.
Confirm with the supplierConfirm objective and stitching coverage, reflectivity/slope suitability, and repeatability and uncertainty on actual samples.
- Public evidence
- The BGA page illustrates height and warpage measurements; the April 2024 brochure explains CSI and model configurations. Its 0.01 nm digital resolution describes displayed detail, not accuracy on every sample.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.