ASE microbump and package failure analysis

ASE · Engineering measurement and characterization

Purpose: Localize suspected micro-bump cold joints/bridges and collect evidence for failure investigation.
Technical approach: Select electrical, X-ray/SAT and localization methods before cross-section/FIB preparation and microscopy/elemental analysis.
Scope of use: Discuss micro-bump/package defects after confirming ASE laboratory acceptance, methods and project scope.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Listed capabilities do not guarantee detection or root-cause determination. Sectioning/FIB preparation may alter evidence.
What to prepare
BLNKK suggests preparing coordinates, process stages, layers/materials, electrical records and controls, planning non-destructive observation before sampling.
Confirm with the supplier
Confirm laboratory, sample acceptance, resolution, sampling/destructive risks and report/follow-up validation scope.
Public evidence: The official laboratory page names micro-bump defects and non-destructive, localization and destructive-preparation capabilities.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.