FOCoS high-density fan-out chip-on-substrate
Large AI/HPC multi-die packages need dense interconnects while balancing thickness, electrical performance, warpage and assembly.
ASE
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- FOCoS high-density fan-out chip-on-substrate · Package architecture and warpage compensation
- ASE FOPoP fan-out package-on-package platform · Package architecture and warpage compensation
Applications: AI, HPC, ML and ASIC-plus-HBM · Vertical fan-out package integration · Microbump defect localization and sampling · Panel free/supported shape reference
Catalog solutions · 4
ASE FOPoP fan-out package-on-package platform
Compare stacked-package architectures and materials against interconnect and high-temperature warpage needs.
ASE microbump and package failure analysis
Localize suspected micro-bump cold joints/bridges and collect evidence for failure investigation.
ASE stress and thermal characterization
Panel-handling assessment needs shape comparisons at consistent process stages and support states.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- ASE FOPoP fan-out package-on-package platform · Warpage reversal during cooling in large 2.5D FCBGA packages →
- FOCoS high-density fan-out chip-on-substrate · Warpage reversal during cooling in large 2.5D FCBGA packages →
- Targeted RDL physical analysis after electrical localization · Cracking and intermittent opens in fine-line RDL after thermal cycling →
- FOCoS fine-line RDL warpage and stress-model reference · Cracking and intermittent opens in fine-line RDL after thermal cycling →
- Targeted microbump cold-joint / void / bridge analysis · Non-wetting, cold joints and opens in HBM thermocompression bonding →
- ASE microbump and package failure analysis · Non-wetting, cold joints and opens in HBM thermocompression bonding →
- Targeted microbump physical analysis after electrical localization · Voltage drop and progressive resistance degradation in high-current microbumps or copper pillars →
- SAT and targeted-section interface-analysis evaluation · New delamination after reflow in moisture-exposed packages →
- ASE stress and thermal characterization · Fan-out panel warpage during chucking and handling →
- Targeted metal-bridge / residue analysis evaluation · RDL line-to-line shorts after fabrication →
- Assess targeted analysis of RDL via openings and bottoms · High initial RDL via contact resistance →
- Assess targeted leakage and interface analysis · Substrate insulation leakage under humidity and bias →
- Evaluation of targeted analysis and sampling of the copper-fill body · Internal voids in substrate microvia copper fill →
- Assessment of targeted pad/electrical alignment analysis · Pad misalignment and electrical opens after hybrid bonding →
- Assessment of depth-resolved TSV morphology sampling · Seams and voids in TSV copper fill →
- Assess targeted TSV liner cross-sections and material analysis · Leakage localization in TSV insulating liners →
- Assess targeted surface analysis of debonding residue · Temporary-bond residue and cleaning compatibility →
- Assess targeted IMC fracture-surface / layer-sequence analysis · Brittle fracture at solder IMC interfaces →
- Assess staged BGA electrical measurements and targeted crack analysis · Board-level BGA solder-joint fatigue under thermal cycling →
- Assess targeted sampling of substrate material beneath pads · BGA drop-induced pad cratering →
- Evaluation of targeted analysis for flip-chip solder bridges · Solder bridging after flip-chip reflow →
Public sources
- Product information: FOCoS high-density fan-out chip-on-substrate
- Technical reference: FOCoS fine-line RDL analysis: summary of 2024 EPTC paper
- Technical reference: 2.5D versus FOCoS thermo-mechanical comparison summary
- Product information: ASE FOPoP fan-out package-on-package platform
- Product information: ASE microbump and package failure analysis
- Product information: ASE stress and thermal characterization
Contact information
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Taiwan · Supplier office · Sales inquiries
ASE — Hsinchu Sales
- Phone
- +886 3 575 3375
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