Entegris NexPlanar CMP pads

Entegris · Process equipment and thermal control

Purpose: Pad contact characteristics and consumable condition are process variables when comparing surface topography after pre-bond CMP.
Technical approach: NexPlanar thermoset polyurethane pads provide the mechanical CMP interface, with hardness and porosity choices across Element and Ultra series.
Scope of use: The published scope is IC CMP. Select a pad for the actual copper/dielectric stack, slurry, conditioning and tool conditions.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Family-level compatibility does not qualify a particular hybrid-bonding stack. Bonding roughness or release thresholds are not supplied.
What to prepare
BLNKK suggests preparing the stack and patterns, slurry and conditioning/process conditions, plus wafer topography, recess and defect data.
Confirm with the supplier
Confirm the series, hardness and porosity, conditioning method, wear monitoring and validation approach for the actual process.
Public evidence: Entegris’s official page and two-page data sheet identify material, hardness, porosity, series and IC CMP applications.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.