ICOS T3 / T7 BGA-ball coplanarity inspection

KLA · Engineering metrology and failure analysis

Purpose: Finished BGA/CSP ball height and coplanarity inspection provides geometric screening data before assembly.
Technical approach: ICOS T3/T7 combines automated optical inspection with configurable 3D metrology modules for ball geometry and package appearance.
Scope of use: Published for outgoing BGA, CSP and WLP inspection, with tray output on T3 and tape output on T7. Select modules for the sample.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Per-ball measurements require optical access and suitable modules; buried assembled balls are outside this direct method. Coplanarity alone does not diagnose opens; confirm current availability of brochure configurations.
What to prepare
BLNKK suggests preparing ball geometry, surface condition, coplanarity tolerance, datum and handling needs, plus repeatability/reproducibility validation.
Confirm with the supplier
Confirm available modules and datum definitions; validate sample-specific detection, measurement error and data output.
Public evidence: The current page confirms T3/T7 and 3D metrology; the brochure explicitly lists BGA/CSP ball coplanarity, position, offset and pitch.

Supporting references

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