SPTS Sigma TSV barrier / seed PVD
KLA · Process equipment and thermal control
- Purpose
- TSV copper fill needs prior barrier/seed sidewall and bottom-coverage comparisons.
- Technical approach
- Sigma deposits metal by PVD; the stated TSV coverage involves the Advanced Hi-Fill ionized PVD source.
- Scope of use
- Official applications include TSV barrier/seed and UBM/RDL; confirm geometry, materials and source/chamber configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsFamily applications do not guarantee every configuration’s deep-via coverage or seam-/void-free subsequent plating. Validate actual vias/films.
What to prepareBLNKK suggests geometry, barrier/seed materials, thermal budget and pretreatment, with sidewall/bottom cross-sections and subsequent-fill comparisons.
Confirm with the supplierConfirm source/chamber, material/geometry windows, degas/preclean, coverage criteria and sample-validation methods.
- Public evidence
- Current Sigma text and the April 2022-revision brochure identify TSV metal deposition.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
These links use established solution relationships. Continue to engineering conditions and evaluation preparation.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.