DMA 303 Eplexor cured-material viscoelastic comparison

NETZSCH Analyzing & Testing · Engineering measurement and characterization

Purpose: Warpage analysis needs material stiffness and damping over relevant temperatures and timescales, rather than one room-temperature modulus.
Technical approach: DMA 303 applies dynamic loading and measures deformation to evaluate storage modulus, loss modulus and tan delta.
Scope of use: For representative cured-polymer or composite specimens, using holders matched to dimensions, stiffness and deformation mode.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Clamping, strain amplitude, frequency and cure state affect results. DMA does not directly measure package warpage; frequency curves alone are not a validated reflow model.
What to prepare
BLNKK suggests preparing material batches, cure histories, specimen dimensions, relevant temperatures/timescales and existing material or warpage data.
Confirm with the supplier
Confirm holders, linear-response checks and calibration, plus the test matrix, data format and options needed for viscoelastic model fitting.
Public evidence: The official product page describes dynamic mechanical analysis, multiple deformation modes and modulus/tan-delta evaluation.

Supporting references

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