LFA 717 HyperFlash material thermal-diffusivity measurement
TIM comparisons and layered thermal models need traceable material diffusivity and conductivity data.
NETZSCH Analyzing & Testing
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View contact information ↓Public capability summary
- Supply material data for TIM comparisons and layered thermal models.
Applications: TIM specimens / material inputs to package models · Thermally cured adhesives / mold resins · Cured underfill/mold materials · Cured materials/substrate coupons · Conditioned/dried material specimens
Catalog solutions · 5
DSC 300 Caliris resin cure and glass-transition analysis
Adhesives/molding resins need residual-cure and glass-transition comparisons to document processing history.
DMA 303 Eplexor cured-material viscoelastic comparison
Warpage analysis needs material stiffness and damping over relevant temperatures and timescales, rather than one room-temperature modulus.
TMA 512 Hyperion expansion and shrinkage comparison
Separate thermal expansion, shrinkage and load-dependent deformation when comparing packaging materials or substrates.
STA 509 Jupiter paired mass and thermal events
Mass loss during heating may reflect moisture, other volatiles or decomposition; interpret it alongside thermal events and specimen history.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- DMA 303 Eplexor cured-material viscoelastic comparison · Warpage reversal during cooling in large 2.5D FCBGA packages →
- TMA 512 Hyperion expansion and shrinkage comparison · Warpage reversal during cooling in large 2.5D FCBGA packages →
- LFA 717 HyperFlash material thermal-diffusivity measurement · Uneven heat-spreader contact and local hot spots in multi-die packages →
- STA 509 Jupiter paired mass and thermal events · New delamination after reflow in moisture-exposed packages →
- LFA 717 HyperFlash material thermal-diffusivity measurement · Thermal coupling and layer temperatures in HBM stacks →
- DSC 300 Caliris resin cure and glass-transition analysis · Heat-spreader seal adhesion and cure →
- DSC 300 Caliris resin cure and glass-transition analysis · Incomplete mold filling and short shots →
Public sources
- Product information: LFA 717 HyperFlash material thermal-diffusivity measurement
- Product information: DSC 300 Caliris resin cure and glass-transition analysis
- Product information: DMA 303 Eplexor cured-material viscoelastic comparison
- Technical reference: TMA 512 Hyperion expansion and shrinkage comparison (PDF)
- Product information: STA 509 Jupiter paired mass and thermal events
Contact information
Contact the supplier directly through its official channels.
This is the Analyzing & Testing division for thermal analysis, thermophysical properties and rheology. Taiwan contacts are supplier-listed regional partners; confirm their coverage for the requested product. The form requires identity confirmation through a follow-up email. Official source ↗
United States · Supplier office · Sales inquiries
NETZSCH Instruments North America, LLC — Sales
- Phone
- +1 781 272 5353
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Taiwan · Supplier-listed distributor
Trendtop Scientific Corp. — NETZSCH-listed Taiwan Regional Partner
- Phone
- +886 2 8227 3628
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Mainland China · Supplier office
NETZSCH Scientific Instruments Trading (Shanghai) Ltd. — Headquarters / Minghua Zhang
- Phone
- +86 21 5108 9255
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More regional contacts (2)
Germany · Headquarters
NETZSCH-Gerätebau GmbH — Analyzing & Testing / General Routing
- at@netzsch.com
- Phone
- +49 9287 881 0
Official source ↗Source checked
Taiwan · Supplier-listed distributor
LIH-YUAN ENTERPRISE CO., LTD. — NETZSCH-listed Taiwan Regional Partner
- Phone
- +886 2 2219 8008
Official source ↗Source checked
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