Helios 5 PFIB-SEM large-area cross-sectioning and failure analysis for advanced packaging

Thermo Fisher Scientific · Reliability qualification and failure analysis

Purpose: Buried interconnect and interface anomalies need targeted sections; localization and preparation affect the evidence obtained.
Technical approach: Xe plasma FIB mills selected areas for SEM inspection, with configuration-dependent large-area sections, 3D analysis and TEM lamella preparation.
Scope of use: For local structural/FA work on advanced 3D packages and interconnect materials, following defect localization.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Milling changes the sample and examines selected regions; preparation effects must be assessed. One image does not establish failure causality.
What to prepare
BLNKK suggests providing the fault location, package stack-up and materials, existing electrical or imaging results, target section direction and acceptable sample destruction.
Confirm with the supplier
Confirm model/options, localization/preparation, sample compatibility and required SEM, 3D or TEM analysis.
Public evidence: The Helios 5 page and 2020 CXe datasheet document Xe milling, large-area sections and gallium-free preparation.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.