Helios 5 PFIB-SEM large-area cross-sectioning and failure analysis for advanced packaging
Buried interconnect and interface anomalies need targeted sections; localization and preparation affect the evidence obtained.
Thermo Fisher Scientific
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- Helios 5 PFIB-SEM large-area cross-sectioning and failure analysis for advanced packaging · Reliability qualification and failure analysis
- ELITE lock-in thermography for 3D electrical fault localization through packages · Reliability qualification and failure analysis
Applications: 2.5D/3D, hybrid bonds, microbumps and TSVs · 2.5D/3D IC, TSV, stacked die and boards · IMC and metallization lamellae · Accessible TSV-adjacent silicon · Temporary-bond/debond residues
Catalog solutions · 5
ELITE lock-in thermography for 3D electrical fault localization through packages
Electrical anomalies in packages, dies or boards can create local heating; localization helps plan subsequent opening/sectioning.
Talos F200X G2 joint-lamella imaging and elemental analysis
Examine localized joint IMC layers and elemental distributions to support failure investigation.
DXR3 Raman spectra for accessible TSV-adjacent silicon
Compare spectra from optically accessible silicon near TSVs to support local strain assessment.
Nicolet iN10 MX infrared analysis of debond residues
Post-debond cleaning review needs residue chemistry and distribution to distinguish adhesive remnants from contamination.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- ELITE lock-in thermography for 3D electrical fault localization through packages · Voltage drop and progressive resistance degradation in high-current microbumps or copper pillars →
- DXR3 Raman spectra for accessible TSV-adjacent silicon · Stress around TSVs and device keep-out design →
- Nicolet iN10 MX infrared analysis of debond residues · Temporary-bond residue and cleaning compatibility →
- Talos F200X G2 joint-lamella imaging and elemental analysis · Brittle fracture at solder IMC interfaces →
- Helios 5 PFIB-SEM large-area cross-sectioning and failure analysis for advanced packaging · Brittle fracture at solder IMC interfaces →
Public sources
- Product information: Helios 5 PFIB-SEM large-area cross-sectioning and failure analysis for advanced packaging
- Public reference: TFS-Assets/MSD/Reference-Materials/innovative-failure-analysis-solutions-for-advanced-packaging-wp.pdf
- Technical reference: Helios 5 PFIB CXe DualBeam datasheet (PDF)
- Public reference: mt/en/home/electron-microscopy/products/electrical-failure-analysis-systems/elite.html.html
- Technical reference: ELITE System nondestructive 3D electrical fault-localization datasheet (PDF)
- Technical reference: EFA-to-PFA workflow for wide-bandgap power MOSFET devices (PDF)
- Product information: Talos F200X G2 joint-lamella imaging and elemental analysis
- Product information: DXR3 Raman spectra for accessible TSV-adjacent silicon
- Product information: Nicolet iN10 MX infrared analysis of debond residues
Contact information
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Taiwan · Supplier office
Thermo Fisher Scientific — Taiwan NanoPort
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- +886 3 6593888
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