ELITE lock-in thermography for 3D electrical fault localization through packages

Thermo Fisher Scientific · Reliability qualification and failure analysis

Purpose: Electrical anomalies in packages, dies or boards can create local heating; localization helps plan subsequent opening/sectioning.
Technical approach: Infrared lock-in thermography detects thermal signals under electrical stimulation. Laser-scanning/marking functions depend on configuration.
Scope of use: For electrically stimulated faults with measurable thermal signatures across package, module, die and board samples; confirm suitability.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
The fault must respond to electrical stimulation and generate a distinguishable thermal signal. A hotspot does not prove root cause. Resolution depends on the sample and setup; VX voltage capabilities and SIL/S-LSM options do not apply to every model.
What to prepare
BLNKK suggests supplying structure/dimensions, electrical symptoms, stimulus/safety limits, existing images, targets and destruction constraints.
Confirm with the supplier
Confirm model/options, stimulus/thermal suitability, localization/depth conditions, sample-specific precision and coordinate/data transfer.
Public evidence: The product page and 2018 datasheet describe nondestructive localization. A 2022 MOSFET application follows ELITE hotspots with PFIB and probing/physical analysis.

Supporting references

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