DXR3 Raman spectra for accessible TSV-adjacent silicon
Thermo Fisher Scientific · Engineering measurement and characterization
- Purpose
- Compare spectra from optically accessible silicon near TSVs to support local strain assessment.
- Technical approach
- DXR3 confocal Raman spectra provide strain-related peak-shift evidence, with thermal/material effects distinguished.
- Scope of use
- Evaluate locations yielding usable silicon signals with validated access, references and stress conversion.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsSilicon examples do not establish DXR3 TSV stress specifications or keep-out acceptance. Arbitrary buried-region coverage is not demonstrated.
What to prepareBLNKK suggests preparing orientation, covering layers, locations, thermal histories and low-strain references, with laser conditions checked for heating.
Confirm with the supplierConfirm wavelength/access, peak calibration, spatial sampling, stress-conversion models and validation on representative TSV specimens.
- Public evidence
- The November 2024 silicon note names DXR3/DXR3xi; its named strain-imaging example uses DXR3xi.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.