AT&S HDI printed circuit boards

AT&S · Package architecture and warpage compensation

Purpose: Compare HDI layers and microvia designs as manufacturing inputs to latent-open investigations.
Technical approach: Sequential build-up and laser microvias form dense interconnects; Anylayer connects layers using microvias.
Scope of use: This is a board-manufacturing option; assess relevance to the actual substrate stack and interfaces.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Manufacturing capability does not establish fault diagnosis, repair or reliability, nor equivalence to IC-substrate microvias.
What to prepare
BLNKK suggests preparing geometry, stack, process/continuity and reflow histories with representative coupons and section locations.
Confirm with the supplier
Confirm supported stack/microvia/material designs, coupons, acceptance and reliability-test scope.
Public evidence: AT&S documents build-up, laser microvias, Anylayer and board applications.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.