Custom high-density IC substrates
High-contact-count processors and multi-die packages need signal and power routing within limited area. Substrate stack-up, interconnect density and thermomechanical behavior need coordinated design.
AT&S
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- IC substrates · high-density interconnect and embedded packaging
Applications: High-performance processors / multi-die packages · Board-level power-component integration · System-board microvia interface/fabrication comparison
Catalog solutions · 3
AT&S ECP embedded component packaging
Compare board-level power-component placement and connections as PDN architecture options.
AT&S HDI printed circuit boards
Compare HDI layers and microvia designs as manufacturing inputs to latent-open investigations.
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Public sources
Contact information
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Taiwan · Supplier office · Sales inquiries
AT&S (Taiwan) Company Limited
- Phone
- +886 2 7752 0750
Official source ↗Source checked
Austria · Headquarters
AT&S Austria Technologie & Systemtechnik AG
- info@ats.net
- Phone
- +43 3842 2000
Official source ↗Source checked
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