Nitto ELEP MOUNT EM die-attach film

Nitto Denko Corporation · Material properties and interface engineering

Purpose: Die-attach void comparisons need coordinated checks of film, lamination, dicing, pickup and placement.
Technical approach: ELEP MOUNT EM combines die-attach film with pressure-sensitive dicing tape for subsequent attachment to a lead frame or interposer.
Scope of use: For die attachment and related stacked processes. Cure and non-cure lineups require grade-specific surface compatibility and processing.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Curing requirements differ by grade. This is neither underfill nor temporary bonding material, and does not guarantee void-free assembly.
What to prepare
BLNKK suggests preparing die/backside and carrier details, film thickness, lamination/dicing/pickup histories and existing void/adhesion data.
Confirm with the supplier
Confirm grade, thickness, supply format, lamination/pickup conditions and whether curing is needed; agree on void, adhesion and reliability tests.
Public evidence: The official page identifies integrated dicing/die attachment and separate EM lineups, not validated void levels or reliability for this package.

Contact the supplier

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