Nitto ELEP MOUNT EM die-attach film
Die-attach void comparisons need coordinated checks of film, lamination, dicing, pickup and placement.
Nitto Denko Corporation
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View contact information ↓Public capability summary
- Die-attach films and semiconductor molding release materials.
Other names: Nitto · 日東電工 · 日东电工
Applications: Die-attach material comparison · Mold seal/release-interface comparison
Catalog solutions · 2
Nitto NITOFLON MPS molding release film
Mold-flash and contact comparisons should include release-film thickness, orientation and mold/resin conditions.
Candidates in engineering problem guides
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Public sources
Contact information
Contact the supplier directly through its official channels.
Use Product Inquiries for semiconductor process tapes and electronic materials, specifying the Nitto product, application, dimensions and end use. Taiwan phones reach the product-sales company; China and US phones provide general regional routing. Official source ↗
United States · General contact
Nitto — Americas General Product Routing
- Phone
- +1 800 755 8273
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Taiwan Nitto Corporation — Taipei / Product Sales
- Phone
- +886 2 2502 1212
Official source ↗Source checked
Mainland China · General contact
Nitto Denko (China) Investment Co., Ltd. — Regional Headquarters / General Routing
- Phone
- +86 21 5208 2277
Official source ↗Source checked
More regional contacts (1)
Taiwan · Supplier office · Sales inquiries
Taiwan Nitto Corporation — Kaohsiung / Product Sales
- Phone
- +886 7 333 5082
Official source ↗Source checked
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