Nitto NITOFLON MPS molding release film

Nitto Denko Corporation · Material properties and interface engineering

Purpose: Mold-flash and contact comparisons should include release-film thickness, orientation and mold/resin conditions.
Technical approach: MPS PTFE film forms a release interface for resin demolding and reduced mold contamination.
Scope of use: For semiconductor resin-encapsulation comparisons, selecting among standard, controlled-expansion and high-strength/high-shrinkage variants.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Changing film does not replace alignment/seal inspection or guarantee flash elimination. Orientation, stretching and thermal shrinkage require process-specific evaluation.
What to prepare
BLNKK suggests gathering grade, thickness/orientation, mold sealing, film tension, resin and pressure/temperature histories, plus flash/contamination locations.
Confirm with the supplier
Confirm grade, dimensions/orientation, processing temperature and feeding recommendations, and trial criteria for resin compatibility, residue and release.
Public evidence: The Japanese page lists applications and directional properties, explicitly labeling tabulated measurements as examples rather than guarantees.

Contact the supplier

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