Sentaurus Interconnect process-history stress and interconnect reliability simulation
Synopsys · Thermo-mechanical simulation and lifetime prediction
- Purpose
- Interconnect stresses accumulate during fabrication; process history matters when assessing local cracking, debonding and voiding risks.
- Technical approach
- Builds 3D structures from design data/process steps, retaining stress history and accounting for multiple sources and proximity effects.
- Scope of use
- For BEOL, TSV and chip-package interaction studies; confirm models/parameters for solder nonlinearity or lifetime work.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsThe historical example has specific geometry/material assumptions. Failure/lifetime estimates need calibrated models, not direct transfer to other products.
What to prepareBLNKK suggests preparing layout/geometry, materials/interfaces, process sequence/temperature, loads, locations and calibration data.
Confirm with the supplierConfirm current versions and model licenses, process-stress and global-to-local transfer methods, parameter calibration, and how lifetime estimates should be compared with tests.
- Public evidence
- The current page and 2025 brochure document full stress history/global-local submodeling. A 2011 newsletter demonstrates cyclic solder viscoplasticity.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
These links use established solution relationships. Continue to engineering conditions and evaluation preparation.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.