Sentaurus Interconnect process-history stress and interconnect reliability simulation
Interconnect stresses accumulate during fabrication; process history matters when assessing local cracking, debonding and voiding risks.
Synopsys
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- Sentaurus Interconnect process-history stress and interconnect reliability simulation · Thermo-mechanical simulation and lifetime prediction
- SLM UCIe MTR IP for die-to-die monitoring, test and repair · Reliability qualification and failure analysis
Applications: TSV, BEOL, microbumps, solder joints and CPI · Chiplet / UCIe · D2D and package electrical channels · RDL contact-material research
Catalog solutions · 4
SLM UCIe MTR IP for die-to-die monitoring, test and repair
Collect repeatable lane-margin and test observations for temperature-dependent die-to-die link errors.
PrimeSim HSPICE channel and receiver-margin comparison
D2D margin assessment needs comparable driver, channel and receiver models.
QuantumATK atomic-interface transport comparison
Compare how material and interface structure may contribute to high contact resistance, alongside measurements of actual contacts.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- SLM UCIe MTR IP for die-to-die monitoring, test and repair · Temperature-dependent errors in chiplet die-to-die links →
- PrimeSim HSPICE channel and receiver-margin comparison · Temperature-dependent errors in chiplet die-to-die links →
- Sentaurus Interconnect process-history stress and interconnect reliability simulation · Cracking and intermittent opens in fine-line RDL after thermal cycling →
- QuantumATK atomic-interface transport comparison · High initial RDL via contact resistance →
- Check inputs for coupled optical/thermomechanical analysis · Temperature-dependent optical coupling drift in CPO →
Public sources
- Product information: Sentaurus Interconnect process-history stress and interconnect reliability simulation
- Technical reference: Sentaurus TCAD product brochure (PDF)
- Technical reference: TCAD News 2011: Reliability analysis of solder joints (PDF)
- Product information: SLM UCIe MTR IP for die-to-die monitoring, test and repair
- Product information: PrimeSim HSPICE channel and receiver-margin comparison
- Product information: QuantumATK atomic-interface transport comparison
Contact information
Contact the supplier directly through its official channels.
For semiconductor and package simulation, use the sales form, select Modeling & Simulation or the relevant product category, and describe the product and your needs. Listed office phones and the Taiwan mailbox provide general routing, rather than dedicated product support or a named sales specialist. Official source ↗
United States · Headquarters
Synopsys Corporate Headquarters — Sunnyvale
- Phone
- +1 650 584 5000
Official source ↗Source checked
Taiwan · Supplier office
Synopsys Taiwan Co., Ltd. — Hsinchu Science Park Branch / Keyan Road
- Phone
- +886 3 623 0288
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Mainland China · Supplier office
Synopsys Semiconductor Technology (Shanghai) Co., Ltd. / Synopsys Software Science and Technology (Shanghai) Co., Ltd.
- Phone
- +86 21 3587 4500
Official source ↗Source checked
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