LINTEC Adwill LE dicing die-bonding tape

LINTEC Corporation · Material properties and interface engineering

Purpose: Die-attach void comparisons need controlled bondline and placement after dicing pickup.
Technical approach: Adwill LE integrates dicing support and die-bonding functions in one tape using film-form attachment material.
Scope of use: Standard-process applications include chip-to-chip and chip-to-substrate attachment; confirm grade, surfaces and process conditions.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Liquid-adhesive bleeding/tilting comparisons do not qualify the user’s assembly or guarantee void-free bonding/reliability.
What to prepare
BLNKK suggests grade, backside/substrate surfaces, film thickness, lamination, pickup/placement and cure history alongside bondline/void observations.
Confirm with the supplier
Confirm compatibility, processing windows, equipment conditions and representative bond/reliability validation.
Public evidence: The LE page describes integrated processing and thin/stacked-package attachment uses.

Contact the supplier

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