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LINTEC Corporation

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Public capability summary

  • Adwill semiconductor dicing, die-attach, bump-support and backside-protection materials.
Material properties and interface design

Other names: LINTEC · Adwill

Applications: Bump-support/fatigue material comparison · Die-attach film/bondline comparison · Plasma-dicing retention-material comparison · Thin-die singulation/backside-protection comparison

Catalog solutions · 4

Candidates in engineering problem guides

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Public sources

Contact information

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These contacts handle semiconductor tapes, wafer lamination and related processing equipment. The online form belongs to LINTEC Advanced Technologies Taiwan; select Semiconductor-related products. Contact local China or US offices for those regions. The US email is an order/business mailbox. Labels, window films and automotive films use separate divisions. Official source ↗

Mainland China · Supplier office · Sales inquiries

LINTEC Advanced Technologies (Shanghai), Inc. — Semiconductor Products

Official source ↗Source checked

More regional contacts (1)

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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.