LINTEC Adwill D UV-curable dicing tape
LINTEC Corporation · Material properties and interface engineering
- Purpose
- Plasma-dicing residue investigations also need retention-material and pickup comparisons.
- Technical approach
- Adwill D retains wafers during dicing, then reduces adhesion after UV irradiation to facilitate pickup.
- Scope of use
- The family lists a plasma-dicing option; validate the selected grade against plasma, thermal and chemical conditions.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsDoes not supply plasma recipes or remove sidewall residues. Separate heat-/solvent-resistant options do not qualify every plasma grade.
What to prepareBLNKK suggests grade, thickness, plasma/temperature history, UV conditions and pickup force alongside retention, sidewall and residue observations.
Confirm with the supplierConfirm grade compatibility, UV/pickup windows, contamination/cleaning criteria and representative process validation.
- Public evidence
- The page names UV adhesion reduction and plasma/laser dicing, without a universal recipe.
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Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.