Furukawa Electric dicing die-attach film

Furukawa Electric Co., Ltd. · Material properties and interface engineering

Purpose: Lamination, dicing, pickup and curing can affect die-attach voids and adhesion.
Technical approach: DDF combines dicing tape with die-attach film, supporting singulation and pickup before final attachment.
Scope of use: Consider grade-specific die-to-substrate, stacked-die or film-over-wire applications.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Typical data and curing examples do not guarantee void-free or reliable assemblies. Conductive DAF is separately available; grades are not automatically interchangeable.
What to prepare
BLNKK suggests preparing surface details, intended bondline thickness, lamination/pickup/cure settings and void or adhesion measurements.
Confirm with the supplier
Confirm the grade, conductivity needs, thickness and availability, along with recommended curing and validation for the actual material combination.
Public evidence: The official page and catalogue list AFN grades, curing examples and typical properties with test conditions.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.