Furukawa Electric dicing die-attach film
Lamination, dicing, pickup and curing can affect die-attach voids and adhesion.
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View contact information ↓Other names: Furukawa Electric · 古河電工 · 古河电工
Applications: Die-attach film/cure comparison · Thin-wafer cutting-retention/pickup comparison · Thin-wafer grind-protection/release comparison
Lamination, dicing, pickup and curing can affect die-attach voids and adhesion.
Thin-wafer singulation needs secure retention followed by controlled pickup, with damage tracked by process stage.
Wafer thinning needs frontside circuit protection and checks for damage or residue during grinding and tape removal.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
Contact the supplier directly through its official channels.
The online form is specifically for semiconductor process tapes; select your region. The tape email comes from the 2022 official catalog; use the current form to confirm the responsible team. For thermal management, select Heat-Dissipation / Cooling Products in the product contact directory to access its separate form, or use the listed regional telephone contacts. Taiwan, China and US numbers route cooling-product inquiries, not semiconductor tape sales. Official source ↗
United States · Supplier office · Sales inquiries
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Taiwan · Supplier office · Sales inquiries
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Mainland China · Supplier office · Sales inquiries
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Mainland China · Supplier office · Sales inquiries
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Japan · Supplier office · Sales inquiries
Official source ↗ · Email source ↗Source checked
Japan · Supplier office · Sales inquiries
Official source ↗Source checked
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