Furukawa Electric UC/FC UV dicing tape

Furukawa Electric Co., Ltd. · Material properties and interface engineering

Purpose: Thin-wafer singulation needs secure retention followed by controlled pickup, with damage tracked by process stage.
Technical approach: The tape holds the workpiece during cutting; UV irradiation reduces adhesion for removal and pickup.
Scope of use: UC serves wafer dicing and FC package dicing, with separate grades for thin wafers, backside metal and small packages.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
It does not repair existing grinding cracks or replace carrier-debonding materials. Typical data do not qualify an ultrathin-wafer process; laser or plasma compatibility is grade-specific.
What to prepare
BLNKK suggests preparing thickness, backside materials, die geometry and cutting/UV/pickup settings, with staged crack, chipping and residue observations.
Confirm with the supplier
Confirm the UC or FC grade, UV and pickup settings, cutting compatibility and a trial inspection plan for the actual workpiece.
Public evidence: The official page and catalogue give UC/FC grade data, adhesion-test conditions and explicitly typical values.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.