Furukawa Electric SP/CP backgrinding tape

Furukawa Electric Co., Ltd. · Material properties and interface engineering

Purpose: Wafer thinning needs frontside circuit protection and checks for damage or residue during grinding and tape removal.
Technical approach: The tape covers the circuit surface during backgrinding. SP is UV-type and CP non-UV, with different removal approaches.
Scope of use: Consider grade-specific thin-wafer or bumped-surface protection matched to topography and subsequent processing.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
It is not rigid-carrier temporary bonding or repair for existing cracks. Thin-wafer, bump and chemical-process uses vary by grade; typical data are not device qualification.
What to prepare
BLNKK suggests preparing target thickness, frontside topography, mounting/grinding settings and before/after removal observations of cracks, warpage and residue.
Confirm with the supplier
Confirm the SP or CP grade, removal method, temperature and chemical compatibility, plus a sample trial and damage inspection approach.
Public evidence: The official page and catalogue separate SP/CP structures, uses and typical data with adhesion-test conditions.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.