R-1515V low-CTE, stress-relaxing FC-BGA substrate material
Panasonic Industry · Material properties and interface engineering
- Purpose
- FC-BGA packages for CPUs, GPUs, FPGAs and ASICs need warpage control while managing solder-ball stress caused by thermal-expansion differences during board assembly.
- Technical approach
- R-1515V combines low-CTE glass cloth with resin flexibility and stress relaxation to address both substrate deformation and assembly stress.
- Scope of use
- Panasonic lists CPU, GPU, FPGA and ASIC FC-BGA substrates. Evaluate material selection against the actual die dimensions, substrate stack-up, copper distribution and board conditions.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsTypical material data and example stack-ups do not guarantee warpage or solder life in a particular assembly. Assess low CTE and compliance together with the substrate, die and board.
What to prepareBring die/package dimensions, core thickness and stack-up, copper distribution, reflow profiles, and existing warpage or solder-failure data to compare material changes.
Confirm with the supplierConfirm available thicknesses, temperature-dependent properties, stress-relaxation data and process compatibility. Ask about support for stack-specific modeling, material trials and board-level reliability validation.
- Public evidence
- The June 2021 release describes commercialization and stress relaxation. The November 2022 datasheet lists typical x/y CTE of 3–5 ppm/°C for R-1515V and explicitly states that values are not guaranteed.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.