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Panasonic Industry

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Public capability summary

  • Low-loss laminates · encapsulation and electronic materials
Material properties and interface designPackage structures and deformation compensationReliability validation and failure analysisProcess equipment and window control

Applications: CPU, GPU, FPGA and ASIC FC-BGA · FOWLP/FIWLP/PLP overmolding and wafer back-coating · Power-device thermal interface aging

Catalog solutions · 3

Candidates in engineering problem guides

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Public sources

Contact information

Contact the supplier directly through its official channels.

Choose Electronic Materials for IC packaging, substrate and electronic assembly materials; choose Electronic Components for graphite and other thermal-management components. Listed Taiwan, China and US phones are electronic-materials sales contacts. Official source ↗

United States · Supplier office · Sales inquiries

Panasonic Devices Sales America — Mountain View / Electronic Materials Sales

Official source ↗Source checked

Taiwan · Supplier office · Sales inquiries

Panasonic Industrial Devices Materials Taiwan Co., Ltd. — Semiconductor Materials Sales

Official source ↗Source checked

Mainland China · Supplier office · Sales inquiries

Panasonic Devices Sales China Co., Ltd. — Shanghai / Semiconductor Encapsulation Materials Sales

Official source ↗Source checked

Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.

BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.