R-1515V low-CTE, stress-relaxing FC-BGA substrate material
FC-BGA packages for CPUs, GPUs, FPGAs and ASICs need warpage control while managing solder-ball stress caused by thermal-expansion differences during board assembly.
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View contact information ↓Applications: CPU, GPU, FPGA and ASIC FC-BGA · FOWLP/FIWLP/PLP overmolding and wafer back-coating · Power-device thermal interface aging
FC-BGA packages for CPUs, GPUs, FPGAs and ASICs need warpage control while managing solder-ball stress caused by thermal-expansion differences during board assembly.
Thin fan-out wafer/panel packages need encapsulants that balance post-mold warpage and processing.
TIM aging comparisons need controlled contact pressure and thickness, with thermal resistance tracked after cycling.
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Choose Electronic Materials for IC packaging, substrate and electronic assembly materials; choose Electronic Components for graphite and other thermal-management components. Listed Taiwan, China and US phones are electronic-materials sales contacts. Official source ↗
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