CV8511C / CV5788 low-warpage encapsulation for FOWLP and PLP

Panasonic Industry · Material properties and interface engineering

Purpose: Thin fan-out wafer/panel packages need encapsulants that balance post-mold warpage and processing.
Technical approach: Panasonic positions the materials around low shrinkage, low stress and low-temperature curing. Its 2022 sheet lists granular CV8511C and liquid CV5788, with form selection tied to package size and thickness.
Scope of use: For WLP/FOWLP/FIWLP/PLP overmolding and wafer back-coating; confirm grade, process and dimensions.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Grade names differ between current and historical sources. Confirm CV5788 availability; example properties do not guarantee customer-package results.
What to prepare
BLNKK suggests preparing package/carrier size, die layout, mold thickness, processing/cure and warpage/fill/reliability targets.
Confirm with the supplier
Confirm grade/supply, property methods, process windows, carrier release, RDL compatibility and sample evaluation.
Public evidence: The current page lists CV8511CUB for FOWLP/PLP. The 2022 CV8511C/CV5788 sheet describes property values as lineup examples, not guaranteed warpage results for every package structure.

Supporting references

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