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NEXAR Ablate glass-core street RDL removal

LPKF Laser & Electronics SE · Packaging processes and engineering validation

Purpose
Glass-core singulation needs a method to remove street metallization and dielectric layers while evaluating effects on the glass.
Technical approach
Tensor Ablation uses ultrashort laser pulses to remove copper RDL and polymer dielectric layers such as ABF.
Scope of use
Consider it for glass-core street and edge preparation, subject to trials with the actual stack.
Limitations and open questions

These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.

Scope and limitations

Removal is not complete singulation or a guarantee against damage or residue. Handling and monitoring depend on configuration.

What to prepare

BLNKK suggests preparing layer materials and thicknesses, glass specifications, street drawings and the downstream cutting flow.

Confirm with the supplier

Confirm the model, monitoring options and removal recipe, plus inspection methods for residue, cross-sectional cracking and glass strength.

Public evidence
The product page describes removal applications and M/S/P configurations; the platform page distinguishes ablation from via formation and bonding.

Supporting references

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.

Related engineering problems

These links use established solution relationships. Continue to engineering conditions and evaluation preparation.

BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.