NEXAR LIDE glass via and microstructure fabrication
Glass-via and interposer development needs a feature-formation process compatible with subsequent metallization and filling.
LPKF Laser & Electronics SE
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Glass micromachining, laser bonding and electronics laser-processing equipment.
Other names: LPKF · LPKF Laser & Electronics
Applications: Glass-core substrates / interposers · Glass-core singulation streets · Glass caps / photonic packages · Wafer solder-printing stencils · LDS-compatible EMC conductive structures
Catalog solutions · 5
NEXAR Ablate glass-core street RDL removal
Glass-core singulation needs a method to remove street metallization and dielectric layers while evaluating effects on the glass.
NEXAR Bond laser-fused glass caps
Glass-cap and photonic packaging needs a joining approach matched to seam geometry and nearby temperature-sensitive structures.
MicroCut X wafer-stencil aperture fabrication
Fine-pitch solder printing needs suitable stencil apertures and fabrication, followed by actual transfer validation.
AMP 3000 selective EMC metallization
Conductive mold-surface structures need assessment of metallization, grounding and electromagnetic use.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- NEXAR LIDE glass via and microstructure fabrication · Internal voids in substrate microvia copper fill →
- MicroCut X wafer-stencil aperture fabrication · Solder bridging after flip-chip reflow →
- NEXAR Bond laser-fused glass caps · Heat-spreader seal adhesion and cure →
- AMP 3000 selective EMC metallization · Package electromagnetic coupling and shielding window →
- NEXAR Ablate glass-core street RDL removal · Heat-affected damage from laser singulation →
Public sources
- Product information: NEXAR LIDE glass via and microstructure fabrication
- Product information: NEXAR Ablate glass-core street RDL removal
- Product information: NEXAR Bond laser-fused glass caps
- Product information: MicroCut X wafer-stencil aperture fabrication
- Product information: AMP 3000 selective EMC metallization
Contact information
Contact the supplier directly through its official channels.
The global product form includes Advanced Packaging Solutions and Thin Glass Precision Processing; specify the technical need. The China contact is the manufacturer’s Shanghai company. Its local page separately lists general sales and the LIDE/TGV glass processing contact. The US number is a North American toll-free line and may not accept overseas calls; the US page also provides a product inquiry form with a LIDE Glass option. Official source ↗
United States · Supplier office · Sales inquiries
LPKF Laser & Electronics North America — Tualatin
- Phone
- +1 800 345 5753
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
乐普科（上海）光电有限公司 / LPKF China
- sales.china@lpkf.com
- Phone
- +86 21 3950 1051
Official source ↗Source checked
Germany · Headquarters
LPKF Laser & Electronics SE — Garbsen
- Phone
- +49 5131 70950
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.