NEXAR LIDE glass via and microstructure fabrication

LPKF Laser & Electronics SE · Packaging processes and engineering validation

Purpose: Glass-via and interposer development needs a feature-formation process compatible with subsequent metallization and filling.
Technical approach: LIDE combines ultrafast laser modification of glass with selective wet etching to form vias, cavities and channels.
Scope of use: Consider it for glass-core substrates, interposers and glass microstructures, with material and equipment configurations assessed for the project.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Glass feature formation does not ensure void-free metal filling or establish suitability for silicon TSV processing.
What to prepare
BLNKK suggests preparing glass composition and thickness, feature drawings and tolerances, substrate format and the downstream metallization flow.
Confirm with the supplier
Confirm the current configuration, supported glass and etching integration, and how sample geometry, surface quality and filling compatibility will be evaluated.
Public evidence: Official pages describe the NEXAR LIDE 5000 M/S/P variants and the two-step technology.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.